SMT Process - SMD Assembly Line
From: Author:SMD Assembly Line Publish time:2020-10-08 19:34 Clicks:0
SMT Process - SMD Assembly Line
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1. Solder paste printer: its function is to print solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a solder paste printer located at the front end of the SMT production line;
2. Dispensing: It is to drop glue onto the fixed position of the PCB, and its main function is to fix the components on the PCB. The equipment used is a glue dispenser located at the front end of the SMT production line or behind the testing equipment;
3. pick and place machine: Its function is to accurately install the SMD components on the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line;
4. Curing oven: Its function is to melt the patch glue, so that the surface assembly components and the PCB board are firmly bonded. The equipment used is curing oven or reflow soldering, located behind the placement machine in the SMT production line;
5. Reflow oven: Its function is to melt the solder paste, so that the SMD components and the PCB board are firmly bonded. The equipment used is a reflow oven, located behind the placement machine in the SMT production line;
6. Inspection equipment: Its function is to inspect the welding quality and assembly quality of the mounted PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of testing;
❙ SMD Assembly Line Video