METAL CORE PCBs (MCPCB) ALUMINUM PCBs
From: Author:PCBs Publish time:2021-09-15 17:03 Clicks:0
Metal Core PCB (MCPCB) or Insulated Metal Substrate (IMS PCB) is a technology developed to overcome the thermal limitations of the FR4 material. Metal Core is a better choice than FR4 if your boards need to perform in high temperature environment.
Insulated Metal Substrate provides electrical isolation between the copper and the metal core by using a special dielectric with the peculiarity of having high thermal conductivity.
The most common material used in the substrate is aluminum, for this reason, these type of boards are usually known as Aluminum PCBs.
METAL CORE PCB APPLICATIONS
PCBs that require a lot of power usually generate a lot of heat. If your PCBs need fast cooling it is better to use Metal Core PCB than FR4. The following list includes some of the most popular applications that work great with this technology:
- LED Lighting
- Power Conversion Systems
- Power Supplies
- Photovoltaics
- Telecom & Industrial
- Automotive Electronics
METAL CORE PCB TECHNOLOGY BENEFITS
Insulated Metal Substrate Technology offers a great list of benefits when an application requires great heat dissipation.
Most engineers and designers rely on Metal Core PCB to take advantage of the following benefits (compared to FR4 PCBs):
- Superior heat dissipation
- Eliminate heat sinks and other voluminous hardware
- Great durability of Aluminum
- Lightweight and strength
METAL CORE PCB STACK-UPS
It consists of a single copper conductive layer on top, a
metal base plate (e.g. Aluminum) to provide rigidness to
the circuit board and a thermal conductive dielectric
working as the insulator.
It has two copper layers and the metal core is between thecopper layers. Plated Through Holes (PTH) are used tointerconnect the acopper layers so SMT and THT componentscan be placed on both sides.
It has more than two conductive layers separated by thermaldielectric. In the bottom of the structure is the metal base. SMTcomponents can only be placed on one side. Not THT components are allowed, but it provides the possibility to make blind and buried vias with internal signal layers and power/ground planes.
SPECIFICATIONS
ITEM | DESCRIPTION | SYMBOL | STANDARD | ADVANCED |
No. of Layer Count | Max Layer Count | NA | 1-4 layer | 1-8 layer |
T-clad Laminate Supplier | Laminate Supplier | NA | Bergquist, polytronics, boyu | Bergquist, polytronics, boyu |
Metal Thickness | M | 0.4-3.2mm | 0.4-3.2mm | |
Dielectric Thickness | E | 100-200um | 100-300um | |
Thermal Conductivity | NA | 1W/m-k , 2W/m-k 3W/m-k | 1W/m-k , 2W/m-k 3W/m-k , 4W/m-k | |
Circuit Width | Outer Layer Min. Circuit Width | W1 | 0.15mm | 0.15mm |
Circuit Spacing | Outer Layer Min. Circuit Spacing | S | 0.15mm | 0.15mm |
Copper Foil Thickness | Copper Foil Thickness | T | ½- 4 oz | 1/3 –6 oz |
Finished Hole | Min. Finished Npth Hole Size | X | 1.0mm | 0.80mm |
Npth Hole Tol. | A | /-0.05mm | +/-0.05mm | |
Max. Aspect Ratio | Max. Aspect Ratio | T:H | 8:1 | 10:1 |
S/M Dam & Clearance | Min. S/m Dam | W1 | 0.10mm (Green S/M); 0.13mm (white S/M) | 0.10mm (Green S/M); 0.13mm (white S/M) |
Min. S/m Clearance | W2 | 0.075mm (Green S/M); 0.075mm (white S/M) | 0.05mm (Green S/M); 0.05mm (white S/M) |
METAL THICKNESS
DIELECTRIC THICKNESS
CIRCUIT WIDTH
CIRCUIT SPACING
COPPER FOIL THICKNESS
CIRCUIT WIDTH
MAX. ASPECT RATIO
S/M DAM & CLEARANCE
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