FLEX PCB TECHNOLOGY APPLICATIONS

At today's world Flex Circuits can be found almost anywhere from gadgets as laptops, tablets, cell phones and smartwatches to airplanes and unmanned vehicles. The list of applications for Flexible Circuits keeps growing and growing.

We provide Flex PCB solutions to companies from the following industries:

• Aerospace
• Automobile industry
• Computers
• Consumer electronics
• Telecommunications
• Medical instruments

FLEX PCB TECHNOLOGY BENEFITS

There is a large list of benefits offered by the Flexible Circuit Technology, it can considerably improve the physical characteristics of a design by reducing both weight and size. The cost and performance advantages of using Flexible Circuits are also points that engineers and designers keep in mind, since this technology is able to offer the following benefits:

PERFORMANCE VS RIGID PCB

• Superior heat dissipation.
• Dynamic Flexing.
• Lower inductance (vs traditional wiring systems).
• Superior package density.

COST VS RIGID PCB

• Wiring harnesses substitution that lead to wiring errors elimination.
• Improved reliability.
• Assembly time and effort reductions that lead to drops in the final assembly costs.

Consisting of a single thin conductive layer, hot-pressed and glued together with a flexible dielectric film to provide electrical insulation and protection from the elements, a single sided Flex PCB is the most basic and most common type of Flex Circuits.

Starting with a Polyimide film as a base layer, two separate conductive layers are then glued and hot-pressed together to both sides of the film. Plated Through Holes (PTH) are used to interconnect the copper layers, and additional layers of polyimide on both sides of the panel brings insulation to the double sided Flex Circuits.

Containing three or more conductive layers, Multilayer Flex circuits manufacturing is performed combining double and single sided Flexible constructions, using adhesive layers to bond them together and interconnecting them by means of plated Vias. Circuit protection and electrical insulation is provided by a Coverlay (usually Polyimide).

Rigid-Flex Circuits are obtained by laminating together flexible and rigid substrates, providing the design not only with strength but with dynamic adaptability as well. The rigid parts are often used to carry components and the flex substrates serve as interconnection paths.