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Heating time of solder paste

From:    Author:Heating time of solder paste    Publish time:2021-09-14 16:17    Clicks:0

The temperature of reflow soldering equipment should follow the requirements of solder paste.

Solder paste manufacturers usually provide quite wide window time for each stage of reflow curve: preheat and constant temperature time 120 to 240 seconds, reflow time 60 to 120 seconds / liquid above.

We discovered that a median overall heating time of four to four 1 / 2 minutes (240-270 seconds) is a good, surprisingly conservative estimate.

For this simple calculation, we suggest that you ignore the cooling link of welded profiles. Cooling is important, but generally does not affect the welding quality unless the PCB cools too fast.

 

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