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Analysis of reflow soldering temperature curve and furnace temperature adjustment

From:    Author:reflow soldering    Publish time:2021-09-14 15:25    Clicks:0

Analysis of reflow soldering temperature curve and furnace temperature adjustment:

Before analyzing the reflow temperature curve, it is necessary to master the data of several control points:

1) Determine the total time from ambient temperature to peak reflux temperature.

2) Process parameters (temperature, time, heating speed) of each temperature zone.

The specific adjustment method of reflow soldering temperature curve is as follows:

Firstly, the total time from ambient temperature to reflow peak temperature is matched with the desired residence time of heating curve by adjusting the conveyor belt speed.

Next, the deviation of the curve (flow sequence) should be adjusted from left to right to ensure that the shape of the overall curve is consistent with the process parameters and given standards of each temperature zone.

For example: if there is a difference between the preheating area and the re-flux area, the difference in the preheating area shall be adjusted correctly first, and it is better to adjust one parameter at a time.

Before further adjustment, the adjusted curve shall be run first and the new curve shall be measured before adjustment.

Because the temperature change of a given temperature zone will affect its subsequent temperature change. Thus, we should adjust the furnace temperature curve step by step.

 

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I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technical team in Asia, Europe, America, Africa, and Australia.

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