Reflow soldering temperature curve measurement methods
From: Author:Reflow soldering Publish time:2021-09-14 15:24 Clicks:0
Reflow soldering temperature curve measurement methods:
- Analyze the thermal performance of PCB and select the tested point.
- Attaching the thermocouple to the PCB below In order to ensure the accuracy of the measurement results, the printed circuit board to be tested shall be completely pasted.

Thermocouple tip
- Trigger the thermometer to start recording the data and put the thermometer together with the tested printed circuit board into the reflow soldering furnace. We should notice two critical factors here:
The first point: there are two kinds of thermometer, one is to start recording data immediately after triggering, which requires that the thermometer be put into reflow soldering oven in the shortest time after triggering, so as to ensure the accuracy of the measured reflow time.
Another kind of thermometer is temperature sensitive type, when the ambient temperature rises to 40 ℃ (generally higher than the body temperature, it is used to ensure that no data will be recorded during the operation phase.)
Only when the data is recorded, there is no requirement for the insertion time of the thermometer.
Second point: in order to restore the actual environment of production to the maximum extent, the number of pass plates in normal production shall be ensured in front of the tested plates.
Once we have put the tested plate into the furnace chamber, then we can not put the product again to avoid accidents.
- Finally, the temperature measuring instrument which collects data from the furnace is connected to the computer to generate the temperature curve.
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