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Selection of test points for reflow soldering temperature curve

From:    Author: reflow soldering    Publish time:2021-09-14 15:20    Clicks:0

Selection of test points for reflow soldering temperature curve:

In fact, in the process of producing a printed circuit board, the temperature of various components in each area of the board is not the same. Besides, the hot air in the furnace flows in the furnace under the action of the hot air blower

(flows from the upper and lower heating plates to the transmission track direction, and spreads along the surface of the printed circuit board to the edge of the board when encountering the barrier, so that the central area of the board becomes the place with the lowest temperature).

PCB testing points

The size of components also determines the temperature. Small components have high temperature and large components have low temperature.

Therefore, in the actual measurement, it is very important to reflect the real temperature of the tested products.

the following principles will help you with making a better temperature test:

  • Select as many points as possible when conditions permit.
  • The measured points shall be selected on the same longitudinal axis as much as possible.
  • Components with special requirements for temperature.
  • The position with the highest temperature of the board surface.

 

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