Reflow soldering, the most common method of attaching surface mount components to a circuit board, plays a critical role in the overall electronics assembly process. Successful reflow soldering depends on knowledge of the reflow process setup, requirements for fixturing and tooling, baseline process parameters and their influence on solder joint quality, and troubleshooting common process defects. Professor Martin Anselm, Ph.D. from Rochester Institute of Technology will guide you through this informative online course providing a basic understanding of the reflow soldering process.

Who Should Take This Course?
This course will be useful for companies who want to train their equipment operators and technicians who want to understand more about the overall process and who have a basic familiarity with the equipment referenced in each section.

Topics Covered

• SMT Process Overview
• Solder Reflow Defects Examples
• Factors Affecting Reflow Soldering
• Key Aspects to Successful Reflow Soldering:
     - Solder Paste Materials
     - Substrates and Surface Finishes
     - Components and Moisture Sensitivity
     - Board Fixturing and Support
     - Warpage
     - Reflow Profiling
     - Equipment
• Solder Reflow Process Parameters
• Keys to Successful Reflow Soldering
• Post - Reflow Verification
• Reflow Process Defects, Causes and Troubleshooting

After taking the online course, the trainee should be capable to accomplish the following tasks:

• Understand basic process including fixturing and tooling
• Understand baseline process parameters
• Identify process defects

Perform defect troubleshooting

Note: some prior familiarity with the specific equipment is expected.

Course Length and Format

• Approximately 90 minutes of recorded material
• Content is sectioned into short video clips ranging from 11 to 23 minutes
• You can download the 124 page PDF to follow along with the recordings
• It will take you an estimated 1-3 hours (cumulative) to complete the course
• A 16 question quiz will test your knowledge retention of the course material
• A certificate of completion can be emailed to you once a satisfactory score is achieved on the quiz

Review Committee:

• Martin Anselm, Ph.D., Rochester Institute of Technology
• Charles Brown, Intervala, LLC
• Ray Chartrand, CharTrain Consulting
• Viswanadham Puligandla Ph.D., Nokia (Retired)
• Carlos Tafoya, AIM Solder

For additional resources, check out archived webinars such as:

• Solder Reflow Fundamentals (2020)
• Jump Start - An Introduction to SMT Process Basics and Troubleshooting (2018)
• Solder Paste Qualification Testing (2018)
• Reflow - Understanding the Complete Process & Defect Prevention (2017)
• Solder Joint Voids - All You Should Know (2017)
• Process Optimization and Defect Elimination for PCB Assembly (2015)
• Head in Pillow Causes & Process Solutions (2014)
• Reflow Soldering Process and Influence on Defects - An In-Depth Look (2013)
•  

Keywords：

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I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technical team in Asia, Europe, America, Africa, and Australia.

I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.

Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:

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