Detection Equipment-8200

8200 is use to examine internal solder joints, BGA, IC and other complex components.It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time observation of clear pictures. In addition, the powerful software measurement function makes the inspection eficiency greatly improved.

Dimensional view of solder balls

Size measurement:Distance, radian,slope,Angle etc.

Auxiliary tool: the circularity, bubblerate, BGA area and throuhold of solder join ts in the selected area can be calculated.

Simulation 3D:BGA and other 3D effects display.

X-Ray Detection Equipment- 8200

1. Foreign original imported micro focal X-ray tube (100Kv closed tube), high sensitive image intensifier, 2 million high-speed

industrial digital CCD camera.Can detect 5 micron sample, image display effect is good.

2. High magnification and system magnification can adjustable, easy to detect tiny defects, quick detection.

3. System navigation map, fast navigation precise positioning.

4. Four-axis linkage, suitable for much mass detection, high detection accuracy.

5. LCD screen for 24 - inch digital image, super - large hd image display.

6. Multi-functional software system.

7. All sealed lead cabinets meet the international standard for X-ray safety.