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FLIP-UP STENCILS | ||||||||||
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.
OVERVIEWFlip-up stencils are small solder paste stencils typically used to print a single component a printed circuit board. They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually. They come with a holder and a squeegee blade. A flip-up stencil is a great tool for PCB rework and printed circuit board assembly. Flip-up Stencils are custom made for any component and can be customized with relief areas, to eliminate removing neighboring components. They have the same footprint and aperture sizes used in a regular production stencil. They can be made in BGA, QFP, PLCC, SOIC, and connector patterns. MAIN FEATURES
Smooth
Aperture Walls
We also offer Laser Cutting Services for Precision Parts SPECS
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I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers, Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology, for the world Customers provide SMT total solutions. There are successful cases of SMT technical team in Asia, Europe, America, Africa, and Australia. I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP. Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information: Tel: +86 13670124230 (WhatsApp/Skype/WeChat) Email: etasmt@foxmail.com |
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文章From:http://www.suneastsmt.com/te_news_industry/2021-09-16/30571.chtml |