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Defect parameter of the soldering process |
Defect parameter of the soldering process
The main influence factor of reflow soldering on SMC / SMD is the thermal shock during soldering. A reliable temperature rising process must be set during operation to reduce the thermal shock stress. If the setting of the reflow soldering process and the control quality of each previous process fail to meet the specified requirements, it will lead to various undesirable phenomena such as SMC / SMD. The defects in reflow welding can be roughly divided into two categories, please have a look: ①The defects are related to metallurgical phenomena, including cold welding, non-wetting, poor wetting, etc.; ②The defects are related to abnormal solder joint shape, including monument, bridge, core suction, solder ball, cavity, etc. The main defects and the related reason & Elimination method are listed below: ![]() Reflow oven soldering defects
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文章From:http://www.suneastsmt.com/te_news_industry/2021-09-14/29364.chtml |