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Topside Alignment Placement (TAP) Process
I.C.T Instruments’ proprietary Topside Alignment Placement (TAP) process aligns placement based on top features, enabling high accuracy placement for a wide range of app...Show Details
Why Manufactures are Still Using Electrolytic Capacitors in Computer Mother Boards
Have you ever looked at a computer motherboard, seen mostly surface mounted components and wondered why the designers chose to use leaded electrolytic capacitors in their...Show Details
I.C.T Custom Tooling Paying Dividends for SEL
Specialized nozzle design delivers near perfect yields for complex connector placement.
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A Look at Material Advancements, Novel Process Development and Dealing with Defects
The abstract of a paper recently presented at SMTA Dallas by I.C.T Instruments’ Advanced Process Lab.
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I.C.T Welcomes Henkel and Keysight to AREA Consortium
Cutting-edge research collaboration enables technology leadership in electronics assembly market.
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I.C.T Demonstrates SM and IMPlatforms at NEPCON China
From high-speed chip placement to multi-span through-hole and more, comprehensive portfolio enables complete factory automation.
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