Fast Chip Shooter SM471 PLUS

The SM471PLUS is a high performance chip shooer which applies two gantries equipped

with 10 spindles per head as well as a new flying vision system. Compared to the existing

SM471 model, its placement speed is increased further to 78,000CPH, which is the highest in the world among chip shooters of the same class. In addition, it is basically applicable to components from 0402(01005inch) chips to maximum 14mm IC components. Its actual productivity and placement quality is improved by applying high-speed and high precision electrical feeders. With two gantries and dual lane, the SM471PLUS supports various production modes to maximize the productivity of SM series machines.

Available for Various Odd-shaped Components

In order to reinforce its capacity to handle odd-shaped components. The gripper nozzle, component lead lift-off (warp) check u

sing a laser sensor, rear sensor and Pin recognition function for PiP placement are added.

. Gripper nozzle

. Rear side reflection recognition

High Precision Force Control

Allows precision placement of PiP insert components, flip chips, etc, by applying the Z axis force control system controlling the force widely from 0.1N to 50N.

Panorama View Function

Since large-sized components are not viewed in one screen, it is hard to adjust their pickup or placement positions. In order to remove such inconvenience, the panorama view function is added to allow large components to be viewed within the FOV of a camera.

Component Monitoring before/after Plancement

Checks for nozzle contamination during production to prevent non-insertion and dumping of a large number of components in advance, ensuring high quality production.Time of inspection-Before/after ANC; before/after component placement; and after component dumping

Multi-Vendor Component Management Function

When the same components are supplied from different component supply devices, this function allows components to be use without changing a PCB file and downloading a new PCB file.

On-the-fly Placement Method

Owing to techwin's own On-the-fly image recognition technology which allows component recognition without stopping while moving after component pickup, placement speed is maximized by minimizing the moving time between the pickup position and placement position and reducing the recognition time to zero.

Added a new function maximizing the operational convenience of customers.

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