BGA Rework Station IR120

IR120 is the most popular BGA rework station with touchscreen control, 3 individual zone, 6 bottom heater with height adjustable, programmable up/bottom heating, 50X high resolution camera system, 3 thermcouple for real-time profiling.

Easily- -adjusted PCB positioning bracket

PCB positioning is realized by V-shaped slots. Flexible, simple and portable universal fixture can protect PCBs, prevent components along PCB edges from damage and PCBs from deformation, and can adapt to the rework of encapsulated BGAs with various sizes. Maximum PCB size to be held is 380mm x 380 mm and the minimum PCB size is 20mm x 20mm.

Independent three- -zone temperature control system

Pro-650's three temperature zone are heated independently, where both upper and lower temperature zones are heated by hot air and the bottom zone is heated by infrared heater with a temperature accuracy of t3'C.

Both upper and lower heaters can control different zones' temperatures simultaneously; the IR pre-heater at the bottom zone can heat PCBs evenly. Meanwhile, IR preheating zone's power output can be adjusted

according to actual requirements so that temperatures can be set reasonably for more safe and reliable rework.

Integrated design for upper temperature zone

Upper heating head and mounting head are designed in an integrated way with the functions of automatic soldering and automatic mounting. Unique hot-air nozzle and mounting head's dual-pressure sensor protection ensure that the BGA chips are not damaged by pressing. At the same time, it is equipped with various BGA hot- air nozzles which can be rotated by 360" arbitrarily, installed and replaced easily, and customized according to customer requirements. The enclosed laser alignment device can help realize fast alignment.

Micrometer is used to realize accurate X/Y-axis and R-angle alignment

Micrometer is used to realize accurate X/Y-axis and R-angle alignment with a precision of t0.02mm.

Accurate optical- -alignment system

High-resolution CCD optical visual alignment system is used with spectral, amplification, fine-tuning, and auto-focus functions and also equipped with automatic chromatism discrimination and brightness adjuster. Imaging resolution can be adjusted manually and displayed by 15" high-definition LCD, thus ensuring a simple, fast and accurate alignment between BGA chips and PCB pads with an alignment accuracy within 0.01-0.02 mm.

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