Multi-Functional Placer SM482 PLUS

The SM482PLUS can be applied to components from 0603 microchips to 22mm IC components by applying the on-the -fly recognition technology patented by Techwin, which enables component placement at the highest speed among all medium speed component placers. In addition, it can recognize components of o 42mm with 0.4mm fine pith with a 45mm camera by applying a high pixel vision system to the stage camera. It also allows high precision (30 micron) placement of IC componets and provides a polygon recognition algorithm for easy registration of compnents of complicated shapes.

Available for Various Odd-shaped Components

In order to reinforce its capacity to handle odd-shaped components. The gripper nozzle, component lead lift-off (warp) check u

sing a laser sensor, rear sensor and Pin recognition function for PiP placement are added.

. Gripper nozzle

. Rear side reflection recognition

High Precision Force Control

Allows precision placement of PiP insert components, flip chips, etc, by applying the Z axis force control system controlling the force widely from 0.1N to 50N.

Panorama View Function

Since large-sized components are not viewed in one screen, it is hard to adjust their pickup or placement positions. In order to remove such inconvenience, the panorama view function is added to allow large components to be viewed within the FOV of a camera.

Component Monitoring before/after Plancement

Checks for nozzle contamination during production to prevent non-insertion and dumping of a large number of components in advance, ensuring high quality production.Time of inspection-Before/after ANC; before/after component placement; and after component dumping

Multi-Vendor Component Management Function

When the same components are supplied from different component supply devices, this function allows components to be use without changing a PCB file and downloading a new PCB file.

On-the-fly Placement Method

Owing to techwin's own On-the-fly image recognition technology which allows component recognition without stopping while moving after component pickup, placement speed is maximized by minimizing the moving time between the pickup position and placement position and reducing the recognition time to zero.

Added a new function maximizing the operational convenience of customers.

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