MULTILAYER BOARD FABRICATION INNER LAYER IMAGING
From: Author:MULTILAYER BOARD Publish time:2021-09-17 15:46 Clicks:0
The first step in building a multilayer printed circuit board is to fabricate the inner layers. The inner layer fabrication process begins with transferring the circuit pattern onto the panel. Circuit patterns are transferred to the panel using a photographic process via photoresist, the photo tool and high intensity light. Photo resist is light sensitive and polymerizes when exposed to light. The first steps in fabricating an inner layer is cleaning the inner layer copper surface and then coating both sides with photoresist aka dryfilm. Next the photo tool is aligned to the panel and, the image is transferred from the photo tool to the inner layer by exposing the dryfilm to high intensity light through clear areas of the photo
tool. In the case of a print and etch inner layer, the resist which is exposed to the light polymerizes and remains during the dryfilm developing operation.
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