Product Name:

RX-6 RX-6B

MODEL:

RX-6

Weight::

1566KG

Delivery Time::

IN Stork

Packing::

Paper Box

CONdition:

Working

Price:

Negotiation

PAYMENT TERM:

T/T, Paypal, Westernunion Are All Allowed

High Light:

smt pick and place equipment

, 

pcb pick and place machine

Chip component: 42,000 CPH (best condition)*1

IC component: 14,000 CPH*1*4

Component size : 0402 (1005) chip ~ 50mm square component * 2

0402 (Inch 01005) chip ~ 50mm square component / 50 × 180mm * 3

Substrate size:

Single track transmission: 50 × 50 ~ 610 × 590 / 905 × 590mm (2 transmissions)

Double track transmission: 50×50～360×250mm

Patch head specifications

6 nozzle heads

3 nozzle heads

Can correspond to dual track production

Space-saving design with a width of 1.25m

Standard equipped with suction/sMD monitor check function

Achieve higher quality *2*4

By replacing the placement head, it is possible to construct an optimal production line that adapts to changes in production variety.

High-speed patching with no pause image recognition

Corresponding to ultra-high components, large components, large substrates

The new matrix tray server TR8S increases the component's ability and productivity.

*1 6×6 nozzle tip

*2 6 nozzle head

*3 3 nozzle head

*4 RX-6B: Option

High speed module placement machine

6×6 nozzle head

6×3 nozzle heads

Specification / model name

RX-6

RX-6B

RX-6

RX-6B

Substrate size

Single track transmission

50×50　～　610×590 / 905×590mm(2 transfers)

Double track transmission

50×50　～　360×250㎜*1

Component height

6mm specification

6/12/20/25/33mm

Component size

Laser recognition

0402 (inch 01005) chip ~ 50mm square component

0402(inch 01005)chip　

~ 33.5mm square component (3 nozzle tip)

0402(inch 01005)chip

~ 50mm square component (6 nozzle tip)

Image Identification

Standard camera*2

3mm ～ 33.5mm Square element

3mm　～　100mmSquare element 50×180mm

High resolution camera

1.0×0.5mm ～ 20mmSquare element

1.0 × 0.5 ~ 48mm square components, or 24 × 72mm

(all options)

Component placement speed

Best condition*3

42,000CPH

34,000CPH

(chip component)

IC*4

14,000CPH

11,000CPH

Component placement accuracy

Laser recognition

±0.04mm(Cpk≧1)

Image recognition*2

±0.04mm

±0.03mm

Component mounting type

Up to 160 species

(Converted to 8mm belt (when using electric double-track belt feeder))

High speed module placement machine

6×6 nozzle head

6×3 nozzle heads

Specification / model name

RX-6

RX-6B

RX-6

RX-6B

Image recognition component position compensation device (VCS)

Standard equipment

Option

Standard equipment

Option

Pickup/SMD Monitor Check

Standard equipment

Option

Standard equipment

Option

Automatic tape cutting device

Standard equipment

Option

Standard equipment

Option

Nozzle

Standard equipment

Option

Standard equipment

Option

Easy control nozzle

Standard equipment

Option

Standard equipment

Option

Virus countermeasure software whitelist antivirus software

Standard equipment

Standard equipment

Standard equipment

Standard equipment

※1 Monorail mode Max 360X450mm

*2 RX-6B: Option.

*3 Monorail transport specifications

*4 The component mounting speed of the IC component is a rough value when 36 points are placed on the M-size substrate. When the square QFP component has an external dimension of 10 mm or less, the components are placed in front and rear, and all the nozzles are simultaneously sucked.